Binder Jetting (BJ)
In binder jetting, materials such as metal, ceramic or sand are bonded in layers using a binder. The following aspects must be taken into account:
Properties:
- Minimum wall thickness: 5 mm
- Lettering and surface details: at least 1 mm
- Minimum diameter for drill holes: 3 mm
- Complete powder removal not guaranteed for very small bores, long channels and small cavities
- Components are aligned to optimize installation space
- For special requirements please make an individual request
Tolerance:
- +/- 0.5%, at least +/- 0.7 mm (ISO 2768-m)
Digital Light Processing (DLP)
In the DLP process, liquid synthetic resins (photopolymers) are cured layer by layer using a projector. The projector projects an image of the layer to be cured onto the resin.
Properties:
- Minimum wall thickness: 1 mm
- Lettering and surface details: at least 0.5 mm
- Minimum diameter for drill holes: 1 mm
- No closed cavities, otherwise the resin cannot drain off
- Overhangs require support structures, the removal of which can affect the surface
- Components are aligned to optimize installation space
- For special requirements please make an individual request
Tolerance:
- +/- 0.2%, at least +/- 0.2 mm
Fused Deposition Modeling (FDM)
In the FDM process, wire-shaped plastic is melted through a nozzle and applied in layers.
Properties:
- Material color can be reworked
- Minimum wall thickness: 1.2 mm
- Lettering and surface details: at least 0.8 mm
- Minimum diameter for drill holes: 2 mm
- Parts are printed with a filling geometry of 15-20% and a wall thickness of 0.8 mm
- Overhangs require support structures, the removal of which can affect the surface
- Components are aligned to optimize installation space
- For special requirements please make an individual request
Tolerance:
- +/- 0.3%, at least +/- 0.3 mm
Liquid Crystal Display (LCD)
LCD technology is similar to DLP technology, but uses an LCD to mask the UV light emitted by an LED array.
Properties:
- Minimum wall thickness: 1 mm
- Lettering and surface details: at least 0.5 mm
- Minimum diameter for drill holes: 1 mm
- No closed cavities, otherwise the resin cannot drain off
- Overhangs require support structures, the removal of which can affect the surface
- Components are aligned to optimize installation space
- For special requirements please make an individual request
Tolerance:
- +/- 0.2%, at least +/- 0.1 mm
Multi Jet Fusion (MJF)
In the MJF process, binder fluid is printed onto a powder bed using a print head. The thermally conductive liquid binds the plastic powder locally.
Properties:
- Minimum wall thickness: 1 mm
- Lettering and surface details: at least 0.5 mm
- Minimum diameter for drill holes: 3 mm
- Complete powder removal not guaranteed for very small bores, long channels and small cavities
- With closed cavities, the powder remains in the component
- Components are aligned to optimize installation space
- For special requirements please make an individual request
Tolerance:
- +/- 0.3%, at least +/- 0.2 mm
MultiJet Modeling (MJM)
In the MJM process, liquid plastics are applied in layers using several nozzles and hardened using UV light. Overhangs require wax support structures.
Properties:
- Very high accuracy and resolution
- Very smooth surfaces
- Wide range of material properties possible
Selective Absorption Fusion (SAF)
SAF technology uses infrared-sensitive HAF (High Absorbing Fluid) to fuse polymer powder layer by layer.
Properties:
- Minimum wall thickness: 1 mm
- Lettering and surface details: at least 0.5 mm
- Minimum diameter for drill holes: 3 mm
- Complete powder removal not guaranteed for very small bores, long channels and small cavities
- With closed cavities, the powder remains in the component
- Components are aligned to optimize installation space
- For special requirements please make an individual request
Tolerance:
- DIN ISO2768-1m
Selective laser melting (SLM)
In the SLM process, fine metal powder is melted layer by layer using a laser.
Properties:
- Minimum wall thickness: 1 mm
- Lettering and surface details: at least 0.5 mm
- Minimum diameter for drill holes: 2 mm
- Complete powder removal not guaranteed for very small bores, long channels and small cavities
- Overhangs require support structures, the removal of which can affect the surface
- Components are aligned to optimize installation space
- For special requirements please make an individual request
Tolerance:
- DIN ISO2768-1m
Selective laser sintering (SLS)
In the SLS process, plastic powder is melted layer by layer with the help of a laser.
Properties:
- Minimum wall thickness: 1 mm
- Lettering and surface details: at least 0.5 mm
- Minimum diameter for drill holes: 3 mm
- Complete powder removal not guaranteed for very small bores, long channels and small cavities
- With closed cavities, the powder remains in the component
- Components are aligned to optimize installation space
- For special requirements please make an individual request
Tolerance:
- +/- 0.3%, at least +/- 0.2 mm (DIN 16742-TG6)
Stereolithography (SLA)
In the SLA process, liquid, UV-curing synthetic resins (photopolymers) are selectively cured by a laser.
Properties:
- Minimum wall thickness: 1 mm
- Lettering and surface details: at least 0.5 mm
- Minimum diameter for drill holes: 1 mm
- No closed cavities, otherwise the resin cannot drain off
- Overhangs require support structures, the removal of which can affect the surface
- For special requirements please make an individual request
Tolerance:
- +/- 0.2%, at least +/- 0.2 mm
Vacuum casting
In vacuum casting, a previously produced master model (e.g. by 3D printing or stereolithography) is duplicated in a silicone rubber mold.
Properties:
- Production of small & prototype series
- Wide range of materials for various applications
- Cost-efficient for large quantities