Basler ace 2 X visSWIR

Basler ace 2 X visSWIR

Insights beyond visible light


The ace 2 X visSWIR cameras, developed for the SWIR spectral range, enable extended views beyond visible light and are ideal for precise industrial and scientific applications. They open up new possibilities in areas such as security inspection and structural analysis by revealing previously hidden properties of materials. These cameras are particularly useful for research, quality control and manufacturing monitoring as they contribute to more efficient processes and improved product quality.

  • visible light + SWIR: Capture images in the visible and invisible wavelength range from 0.4 µm to 1.7 µm.
  • High-resolution images: High level of detail thanks to sensitive Sony IMX990/991 SenSWIR sensors.
  • Compact size: Easy integration thanks to a small and compact housing.
  • Versatile interfaces: Supports GigE and USB 3.0 interfaces for improved data transfer and compatibility with different systems.
  • Value for money: Offers high quality SWIR products at affordable prices.
  • Durability and reliability: Our products are renowned for their durability, backed by a three-year guarantee.
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Insight into the interior

Light in the short-wave infrared range (SWIR) makes it possible to perceive many materials as transparent. Short-wave infrared cameras (SWIR) therefore offer the possibility of gaining insights beneath the surface. In this way, for example, defects in fruit and vegetables can be identified, fill levels in otherwise opaque containers can be checked or electronic devices can be checked to ensure they are fully assembled.

Basler ace 2 X visSWIR
Basler ace 2 X visSWIR

Heat detection


SWIR cameras can be used for measuring or estimating the temperature of objects from a temperature of around 140°C. In the SWIR spectral range, different temperatures lead to different brightness levels. This special feature can be used, for example, to inspect weld seams or to monitor processes.

Typical areas of application for SWIR cameras


The possible applications of vision systems in the SWIR spectral range are diverse and range from the inspection of semiconductors and recycling to the quality inspection and sorting of foodstuffs.

As silicon is permeable in the SWIR range, defects such as cavities, cracks and impurities can be detected during the manufacture and inspection of semiconductors.

SWIR technology enables the detection of defects in silicon blocks and photovoltaic cells that cannot be detected in the visible range. This is important for the inspection of individual or entire solar modules.


In the short-wave infrared (SWIR) wavelength range, different materials can be differentiated and sorted based on their unique optical properties. This enables the targeted separation of different types of plastic during recycling, for example.


In the short-wave infrared radiation (SWIR) range, it is possible to detect fill levels through materials that are not normally transparent. This technology can be used, for example, for plastic bottles in beverage bottling or for blister packaging in the pharmaceutical industry.


In the production of banknotes and ID documents, security features such as metal strips hidden under the surface can be checked for irregularities or forgeries. It is also possible to examine special printing inks that are visible in the infrared spectrum.


In the quality assurance of agricultural products, it is possible to detect defects that are hidden beneath the surface. This technology also makes it possible to differentiate between the product and impurities, such as between a potato and a stone.

Feature comparison of the Basler visSWIR cameras

FeatureBasler ace 2 a2A640-240umSWIR (USB 3.0)
Basler ace 2 a2A640-240gmSWIR (GigE)
Basler ace 2 a2A1280-125umSWIR (USB 3.0)
Basler ace 2 a2A1280-80gmSWIR (GigE)
ManufacturerBaslerBasler
Sensor VendorSonySony
SensorIMX991IMX990
ClosureGlobal shutterGlobal shutter
Sensor format1/4″1/2″
Sensor typeInGaAsInGaAs
Sensor size3.2 mm x 2.6 mm6.4 mm x 5.1 mm
Resolution (H x V)640 px x 512 px1280 px x 1024 px
ResolutionVGA1.3 MP
Pixel size (H x V)5 μm x 5 μm5 μm x 5 μm
Frame rate240 fps80 fps (GigE), 125 fps (USB3)
Mono/colorMonoMono
SpectrumVisible + SWIRVisible + SWIR
InterfaceUSB 3.0 / GigEUSB 3.0 / GigE
Pixel depth8 bits, 10 bits, 12 bits8 bits, 10 bits, 12 bits
Synchronizationfree-run, hardware trigger, software triggerfree-run, hardware trigger, software trigger
Exposure controlhardware trigger, programmable via the camera APIhardware trigger, programmable via the camera API
Digital input11
General purpose I/O22
Power supplyVia USB 3.0 interface / PoE or 12-24 VDCVia USB 3.0 interface / PoE or 12-24 VDC
Enclosure typeBoxBox
Housing size (L x W x H)42.8 mm x 29 mm x 29 mm55.5 mm x 29 mm x 29 mm
Weight85 g100 g
Lens mountC-mountC-mount
Operating temperature-10 °C - 60 °C-10 °C - 60 °C

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